| 24 |
Yohan Kim and SoYoung Kim |
A Process-Aware Compact Model for GIDL-Assisted Erase Optimization of 3-D V-NAND Flash Memory |
IEEE Transactions on Electron Devices |
vol. 70,
no. 4 |
202303 |
SCI |
ICDS |
| 23 |
Hyunjoon Jeong, Sangmin Woo, Jinyoung Choi, Hyungmin Cho, Yohan Kim, Jeong-Taek Kong?and SoYoung Kim |
Fast and Expandable ANN-Based Compact Model and Parameter Extraction for Emerging Transistors |
?IEEE Journal of the Electron Devices Society |
Vol. 11 |
202302 |
SCI |
ICDS |
| 22 |
GiWon Kim and SoYoung Kim |
Design of Packaged Multi-radius Multi-path Solenoidal Inductor for Redistribution Layers |
Journal of Semiconductor Technology and Science |
vol.22, no.6 |
202212 |
SCI |
ICDS |
| 21 |
|
Machine-Learning-Based Compact Modeling for sub-3-nm-Node Emerging Transistor |
MDPI Electronics |
vol.11, no.17 |
202209 |
SCI |
ICDS |
| 20 |
Songkil Yoo and SoYoung Kim |
Leakage Optimization of the Buried Oxide Substrate of Nanosheet Field-Effect Transistors |
IEEE Transactions on Electron Devices |
vol.69, no. 8 |
202208 |
SCI |
ICDS |
| 19 |
TaeWoong Kim and SoYoung Kim |
Electronic design automation requirements for R2R printing foundry |
Flexible and Printed Electronics |
vol.7, no.1 |
202202 |
SCI |
ICDS |
| 18 |
JunHa Suk,
ChanYeop Ahn,
S M Mojahidul Ahsan
and SoYoung Kim |
A stable 4-bit ALU design
for printed devices |
Flexible and
Printed Electronics |
vol.7,
no.1 |
202201 |
SCI |
ICDS |
| 17 |
TaeWoong Kim,
YoungBong Han,
Hung Khac Le,
JongWan Shim,
KwangMo Yang,
BumHee Bae,
and SoYoung… |
Periodic Ground Structure
for C-PHY Signaling
in Mobile Application |
Journal of Semiconductor
Technology and Science |
vol.21,
no.5 |
202110 |
SCI |
ICDS |
| 16 |
Hung Khac Le,
Hoang Van Nguyen,
Youngbong Han,
and SoYoung Kim |
Built-in
Ring Transmission Line Structure
for Signal Integrity
Optimization of
PAM4 Signaling in PCBs |
IEEE Transactions
on
Electromagnetic compatibility |
vol. 63,
no. 6 |
202106 |
SCI |
ICDS |
| 15 |
Hung Khac Le,
SoYoung Kim |
Machine Learning Based
Energy-Efficient Design
Approach for Interconnects
in Circuits and Systems |
|
vol11,
no. 3 |
202101 |
SCI |
ICDS |
