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Analog & RF Circuit and System Research Center

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9 Jawad Yousaf, Doojin Lee, JunHee Han, Hosang Lee, Muhammad Faisal, Jeongeun Kim and Wansoo Nah Near-Field Immunity Test Method for Fast Radiated Immunity Test Debugging of Automotive Electronics Electronics Vol. 8, No. 797, pp.1-18 201907 SCI EMC
8 J.S. LEE, J.R. HA, M.H. KIM, S.W. YUN, Y.S. KIM, and W. Nah Prediction of conducted emission in a PMSM-drive braking system using a circuit model combined with EM simulation International Journal of Automotive Technology Vol. 20, No. 3, pp. 487-498 201906 SCI-E EMC
7 Jawad Yousaf, Muhammad Faisal, Jinsung Youn, and Wansoo Nah Design of experiment (DOE) Analysis of System Level ESD Noise Coupling to High-Speed Memory Modules MDPI Electronics Vol. 8 No. 210, pp. 1-25 201902 SCI-E EMC
6 Jawad Yousad, Hosang Lee, Wansoo Nah System Level ESD Analysis: Acomprehensive 2 on ESD Coupling Analysis Techniques Jouranl of Electrical Engineering and Technology Vol. 13, No. 5, pp. 2033-2045 201809 SCI-E EMC
5 Jawad Yousad, Hosang Lee, Wansoo Nah System Level ESD Analysis: Acomprehensive 1 on ESD Generator Modeling Jouranl of Electrical Engineering and Technology Vol. 13, No. 5 201809 SCI-E EMC
4 Sang-Woo Kim, Kwangho Kim, Wansoo Nah, Cheul-Ro Lee, Seung-Boo Jung, And Jong-Woong Kim Transparent and Flexible High frequency transmission Lines Based on Composite Structure Comprising Silver Nano wires and Polyvinyl Butyral Vol. 159, pp. 25-32 201803 SCI EMC
3 Jawad Yousaf, Myeongkoo Park, Hosang Lee, Jinsung Youn, Daehee Lee, Chanseok Hwang, and Wansoo Nah Efficient Circuit and an EM Model of an Electrostatic Discharge Generator IEEE Transactions On Electromagnetic Compatibility No. 99, pp. 1-9 201801 SCI EMC
2 Jawad Yousaf, Jaeyoung Shin, Kwangho Kim, Jinsung Youn, Daehee Lee, Changseok Hwang, and Wansoo Nah System Level ESD Coupling Analysis Using Coupling Transfer Impedance Function IEEE Transactions On Electromagnetic Compatibility Vol. 60, No. 2, pp. 310-321 201804 SCI EMC
1 Dongyoun Seo, Hosang Lee, Myeongkoo Park, and Wansoo Nah Enhancement of Differential Signal Integrity by employing a Novel Face Via Structure IEEE Transactions On Electromagnetic Compatibility Vol. 60, No. 1, pp. 26-33 201802 SCI EMC